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常见封装形式简介

DIP = Dual Inline Package = 双列直插封装 HDIP = Dual Inline Package with Heat Sink = 带散热片的双列 直插封装

SDIP = Shrink Dual Inline Package = 紧缩型双列直插封装 SIP = Single Inline Package = 单列直插封装 HSIP = Single Inline Package with Heat Sink = 带散热片的单列直插 封装

SOP = Small Outline Package = 小外形封装

HSOP = Small Outline Package with Heat Sink = 带散热片的小外形封 装

eSOP = Small Outline Package with exposed thermal pad = 载体外露 于塑封体的小外形封装

SSOP = Shrink Small Outline Package = 紧缩型小外形封装

TSSOP = Thin Shrink Small Outline Package = 薄体紧缩型小外形封装 TQPF = Thin Profile Quad Flat Package = 薄型四边引脚扁平封装 PQFP = Plastic Quad Flat Package = 方形扁平封装 LQPF = Low Profile Quad Package = 薄型方形扁平封装

eLQPF = Low Profile Quad Flat Package with exposed thermal pad = 载体外露于塑封体的薄型方形扁平封装

DFN = Dual Flat Non-leaded Package = 双面无引脚扁平封装 QFN = Quad Flat Non-leaded Package = 双面无引脚扁平封装 TO = Transistor package = 晶体管封装 SOT = Small Outline of Transistor = 小外形晶体管 BGA = Ball Grid Array = 球栅阵列封装

BQFP = Quad Flat Package With Bumper = 带缓冲垫的四边引脚扁平封装 CAD = Computer Aided Design = 计算机辅助设计 CBGA = Ceramic Ball Grid Array = 陶瓷焊球阵列 CCGA = Ceramic Column Grid Array = 陶瓷焊柱阵列 CSP = Chip Size Package = 芯片尺寸封装 DFP = Dual Flat Package = 双侧引脚扁平封装 DSO = Dual Small Outline = 双侧引脚小外形封装 3D = Three-Dimensional = 三维 2D = Two-Dimensional = 二维 FCB = Flip Chip Bonding = 倒装焊 IC = Integrated Circuit = 集成电路 I/O = Input/Output = 输入/输出

LSI = Large Scale Integrated Circuit = 大规模集成电路 MBGA = Metal BGA = 金属基板 BGA MCM = Multichip Module = 多芯片组件 MCP = Multichip Package = 多芯片封装

MEMS = Microelectro Mechanical System = 微电子机械系统 MFP = Mini Flat Package = 微型扁平封装MSI = OLB = PBGA = PC = PGA = SIP = SOIC = SOJ = SOP = SOP = WB = WLP =

Medium Scale Integration = 中规模集成电路 Outer Lead Bonding = 外引脚焊接 Plastic BGA = 塑封 BGA Personal Computer = 个人计算机 Pin Grid Array = 针栅阵列 System In a Package = 系统级封装 Small Outline Integrated Circuit = 小外形封装集成电路 Small Outline J-Lead Package = 小外形 J 形引脚封装 Small Outline Package = 小外形封装 System On a Package = 系统级封装 Wire Bonding = 引线健合 Wafer Level Package = 晶圆片级封装

常用文件、表单、报表中英文名称

清除通知单 Purge notice

工程变更申请 ECR(Engineering Change Request) 持续改善计划 CIP(continuous improvement plan) 戴尔专案 Dell Project 收据 Receipt 数据表 Data sheet 核对表 Check list 文件清单 Documentation checklist 设备清单 Equipment checklist 调查表，问卷 Questionnaire 报名表 Entry form 追踪记录表 Tracking log 日报表 Daily report 周报表 Weekly report 月报表 Monthly report 年报表 Yearly report 年度报表 Annual report 财务报表 Financial report 品质报表 Quality report 生产报表 Production report 不良分析报表 FAR(Failure analysis report) 首件检查报告 First article inspection report 初步报告（或预备报告） Preliminary report 一份更新报告 An undated report 一份总结报告 A final report

纠正与改善措施报告(异常报告单) CAR (Corrective Action Report) 出货检验报告 Outgoing Inspection Report 符合性报告（材质一致性证明） COC(Certificate of Compliance) 稽核报告 Audit report 品质稽核报告 Quality audit report制程稽核报告 Process audit report 5S 稽核报告 5S audit report 客户稽核报告 Customer audit report 供应商稽核报告 Supplier audit report 年度稽核报告 Annual audit report 内部稽核报告 Internal audit report 外部稽核报告 External audit report SPC 报表(统计制程管制) Statistical process control 工序能力指数(Cpk) Process capability index （规格)上限 Upper limit （规格）下限 Lower limit 规格上限 Upper Specification Limit(USL) 规格下限 Lower Specification Limit(LSL) 上控制限（或管制上限） Upper Control Limit(UCL) 下控制限（或管制下限） Lower Control Limit(LCL) 最大值 Maximum value 平均值 Average value 最小值 Minimum value 临界值 Threshold value / critical value MRB 单(生产异常通知报告) Material Review Board Report 工艺流程图 Process Flow Diagram

物料清单（产品结构表/用料结构表） BOM (Bill of Materials ) 合格供应商名录 AVL (Approved Vendor List) 异常报告单 CAR 工程规范报告通知单（工程变更通知） ECN TECN

自主点检表 Self Check List 随件单（流程卡） Traveling Card (Run Card) 压焊图 Bonding diagram 晶圆管制卡 Wafer inspection card 晶圆进料品质异常反馈单 Feedback Report for Wafer Incoming Quality Problems 订购单 PO(Purchase Order) 出货通知单 Advanced Ship Notice 送货单/交货单 DO(Delivery Order) 询价单 RFQ(Request for quotation) 可靠性实验报告 Reliability Monitor Report 产品报废单 PSB 特采控制表 CRB 返工单 PRB 异常处理行动措施 OCAP