Ó¢ÎÄÖÊÁ¿ÊõÓï ÏÂÔØ±¾ÎÄ

ÄÚÈÝ·¢²¼¸üÐÂʱ¼ä : 2026/6/6 3:46:57ÐÇÆÚÒ» ÏÂÃæÊÇÎÄÕµÄÈ«²¿ÄÚÈÝÇëÈÏÕæÔĶÁ¡£

Ó¢ÎÄÖÊÁ¿ÊõÓï

´ÓÊÂÖÊÁ¿¶àÄ꣬µ«ÔÚ½»Á÷µÄʱºòÈÔ»á¶ÔһЩÊõÓӢÎļò³Æ£©¸ã²»Çå³þ£¬ÏÖÆÕ¼°Ò»ÏÂ

²¿ÃÅÃû³ÆµÄרÓÐÃû´Ê QS:Quality systemÆ·ÖÊϵͳ CS:Coutomer Sevice ¿Í»§·þÎñ QC:Quality controlÆ·ÖʹÜÀí

IQC:Incoming quality control ½øÁϼìÑé LQC:Line Quality Control Éú²úÏ߯·ÖÊ¿ØÖÆ IPQC:In process quality control ÖÆ³Ì¼ìÑé FQC:Final quality control ×îÖÕ¼ìÑé OQC:Outgoing quality control ³ö»õ¼ìÑé QA:Quality assurance Æ·Öʱ£Ö¤

SQA:Source(supplier) Quality Assurance ¹©Ó¦ÉÌÆ·Öʱ£Ö¤(VQA) CQA£ºCustomer Quality Assurance¿Í»§ÖÊÁ¿±£Ö¤ PQA rocess Quality Assurance ÖÆ³ÌÆ·Öʱ£Ö¤ QE:Quality engineer Æ·Öʹ¤³Ì CE:component engineeringÁã¼þ¹¤³Ì EE:equipment engineeringÉ豸¹¤³Ì ME:manufacturing engineeringÖÆÔ칤³Ì TE:testing engineering²âÊÔ¹¤³Ì PPE roduct Engineer ²úÆ·¹¤³Ì IE:Industrial engineer ¹¤Òµ¹¤³Ì

ADM: Administration DepartmentÐÐÕþ²¿ RMA:¿Í»§ÍË»ØÎ¬ÐÞ CSDI:¼ìÐÞ

PC:producing controlÉú¹Ü MC:mater controlÎï¹Ü

GAD: General Affairs Dept×ÜÎñ²¿ A/D: Accountant /Finance Dept»á¼Æ LAB: LaboratoryʵÑéÊÒ DOE:ʵÑéÉè¼Æ HR:ÈË×Ê PMC:Æó»® RD:Ñз¢ W/H:²Ö¿â SI:¿ÍÑé

PD: Product DepartmentÉú²ú²¿ PA:²É¹º(PUR: Purchaing Dept)

SMT:Surface mount technology ±íÃæÕ³×ż¼Êõ MFG:Manufacturing ÖÆÔì

MIS:Management information system ×ÊѸ¹ÜÀíϵͳ DCC:document control center Îļþ¹ÜÖÆÖÐÐÄ ³§ÄÚ×÷ÒµÖеÄרÓÐÃû´Ê QT:Quality targetÆ·ÖÊÄ¿±ê QP:Quality policyÄ¿±ê·½Õë

QI:Quality improvementÆ·ÖʸÄÉÆ CRITICAL DEFECT:ÑÏÖØÈ±µã£¨CR£© MAJOR DEFECT:Ö÷Ҫȱµã£¨MA£© MINOR DEFECT:´ÎҪȱµã£¨MI£© MAX:Maximum×î´óÖµ MIN:Minimum×îСֵ DIA iameterÖ±¾¶ DIM imension³ß´ç

LCL:Lower control limit¹ÜÖÆÏÂÏÞ UCL:Upper control limit¹ÜÖÆÉÏÏÞ EMI:µç´Å¸ÉÈÅ ESD:¾²µç·À»¤ EPA:¾²µç±£»¤ÇøÓò ECN:¹¤³Ì±ä¸ü

ECO:Engineering change order¹¤³Ì¸Ä¶¯ÒªÇ󣨿ͻ§£© ECR:¹¤³Ì±ä¸üÐèÇóµ¥

CPI:Continuous Process Improvement Á¬Ðø¹¤Ðò¸ÄÉÆ Compatibility£º¼æÈÝÐÔ Marking£º±ê¼Ç DWG rawingÍ¼Ãæ Standardization£º±ê×¼»¯ Consensus£ºÒ»Ö Code£º´úÂë

ZD:Zero defectÁãȱµã Tolerance£º¹«²î

Subject matter£ºÖ÷ÒªÊÂÏî Auditor£ºÉóºËÔ±

BOM:Bill of materialÎïÁÏÇåµ¥ Rework£ºÖع¤

ID£ºidentificationʶ±ð,¼ø±ð,Ö¤Ã÷ PILOT RUN: (ÊÔͶ²ú) FAI:Ê×¼þ¼ì²é

FPIR£ºFirst Piece Inspection ReportÊ×¼þ¼ì²é±¨¸æ FAA:Ê×¼þÈ·ÈÏ SPC£ºÍ³¼ÆÖƳ̹ÜÖÆ

CP: capability index£¨×¼È·¶È£©

CPK: capability index of process(ÖÆ³ÌÄÜÁ¦) PMP:ÖÆ³Ì¹ÜÀí¼Æ»®£¨Éú²ú¹ÜÖÆ¼Æ»®£© MPI:ÖÆ³Ì·ÖÎö

DAS efects Analysis System ȱÏÝ·ÖÎöϵͳ PPB£ºÊ®ÒÚ·ÖÖ®Ò» Flux£ºÖúº¸¼Á P/N:ÁϺÅ

L/N£ºLot NumberÅúºÅ Version£º°æ±¾ Quantity£ºÊýÁ¿

Valid date£ºÓÐЧÈÕÆÚ

MIL-STD£ºMilitary-Standard¾üÓñê×¼ ICT: In Circuit Test (Ïß·²âÊÔ)

ATE£ºAutomatic Test Equipment×Ô¶¯²âÊÔÉ豸 MO: Manafacture OrderÉú²úµ¥ T/U: Touch Up (ÎýÃæÐÞ²¹) I/N:ÊÖ²å¼þ P/T:³õ²â

F/T: Function Test (¹¦ÄܲâÊÔ-ÖÕ²â) AS ×éÁ¢ P/K:°ü×°

TQM:Total quality controlÈ«ÃæÆ·ÖʹÜÀí

MDA:manufacturing defect analysisÖÆ³Ì²»Á¼·ÖÎö(ICT) RUN-IN:ÀÏ»¯ÊµÑé HI-pot£º¸ßѹ²âÊÔ

FMI£ºFrequency Modulation Inspect¸ßƵ²âÊÔ DPPM: Defect Part Per Million

(²»Á¼ÂʵÄÒ»ÖÖ±í´ï·½Ê½£º°ÙÍò·ÖÖ®Ò») 1000PPM¼´Îª0.1% Corrective Action: (CAR¸ÄÉÆ¶Ô²ß) ACC£ºÔÊÊÕ REJ:¾ÜÊÕ

S/S£ºSample size³éÑù¼ìÑéÑù±¾´óС

SI-SIV£ºSpecial I-Special IVÌØÊâ³éÑùˮƽµÈ¼¶