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Thermal grease for Infineon modules
What should be the behavior and how a grease has to look like
Baginski
IFAG AIM PMD ID AE 2007-06-01
Considerations
Infineon modules with baseplate: Roughness of baseplate RZmax. = 16 μm;RZtyp. = 4 – 6 μm Infineon modules without baseplate: Roughness of ceramic RZmax. = 9 μm; RZtyp. = 3 – 4 μm
Heatsink: Specification of roughness regarding Application Note Modules with and without baseplate: RZmax. = 10 μm
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain
functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 2
Considerations
Example of roughness of baseplate and heatsink
Baseplate RZtyp. = 6 μm
RZmax. = 10 μm Heatsink The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 3