基于adn8830及msp430的tec温度控制电路的学位论文 下载本文

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毕业设计:基于ADN8830的半导体温度控制系统

摘 要

本设计提出一种基于AD 公司的热电制冷控制器ADN8830的高性能、高稳定性的

TEC 控制电路。该电路通过简单的电容、电阻构成的外部PID( 比例积分微分) 补偿网络,能够使目标温度在30s内稳定在最佳工作点,温度控制精度可0.1℃。控制核心采用MSP430单片机,单片机通过数字温度传感器DS18B20读取当前温度,通过DAC输出电压控制信号给ADN8830来调节流过TEC的电流。实验结果表明该方案具有效率高、功耗低、体积小等优点。

关键词:ADN8830; TEC; 温度控制; MSP430; PID

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Application of ADN8830 in Automatic Temperature Control of

TEC

Abstract

A Thermo- Electric Cooler (TEC) control circuit of high performance and stability is presented, which is developed by a thermoelectric cooler controller, named ADN8830, produced by Analog Devices Inc. An outside Proportion Integral Differential (PID) compensation network constructed by simple capacitances and resistors, which can make the temperature of detector reach the optimum operating point in 30s and the precision of this control circuit is 0.1℃. The MSP430 microcontroller implements a controller using a digital temperature sensor DS18B20 to read the current temperature, a digital - to- analog converter DAC8571 to output a control signal to ADN8830 which adjusts the current through the TEC. The experimental results show that this scheme of temperature control has the advantage of high effectiveness, low power and compact size.

Keywords: ADN8830;TEC;temperature control;MSP430;PID

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目 录

第一章 绪 论 .................................................................................................................... V

1.1课题研究背景及意义 ............................................................................................ V 1.2半导体制冷原理 .................................................................................................... V 1.3 半导体制冷技术的国内外发展 ......................................................................... VII 1.4论文主要研究内容及章节分布 ........................................................................ VIII 第二章 系统方案设计 ......................................................................................................... 9

2.1 系统设计要求 ........................................................................................................ 9 2.2系统方案设计 ......................................................................................................... 9

2.2.1设计方案一 .................................................................................................. 9 2.2.2 设计方案二 ............................................................................................... 11 2.2.3 方案对比与选择 ....................................................................................... 12 2.3 系统方案设计 ...................................................................................................... 13 第三章 系统硬件设计 ....................................................................................................... 16

3.1 引言 ...................................................................................................................... 16 3.2 系统电源设计 ...................................................................................................... 16 3.3 单片机及其外围电路设计 .................................................................................. 17

3.3.1单片机MSP430F149及其最小系统的设计 ............................................ 17 3.3.2液晶显示器LCD12864的设计 ................................................................ 18 3.3.3独立式按键的设计 .................................................................................... 20 3.3.4测温电路的设计 ........................................................................................ 20 3.4ADN8830及其外围电路设计 .............................................................................. 21

3.4.1ADN8830芯片介绍 ................................................................................... 22 3.4.2温度采集与温度设定电路设计 ................................................................ 23 3.4.3选频网络设计 ............................................................................................ 26 3.4.4PID补偿网络设计 ...................................................................................... 27 3.4.5其他外围电路设计 .................................................................................... 29 3.5功率驱动H桥模块的设计 .................................................................................. 29 第四章 软件设计 ............................................................................................................... 32

4.1引言 ....................................................................................................................... 32 4.2设计调试环境及工具 ........................................................................................... 32 4.3 主程序的设计 ...................................................................................................... 33 4.4 LCD12864显示子程序的设计 ............................................................................ 40 4.5时间显示子程序的设计 ....................................................................................... 42 4.6按键子程序的设计 ............................................................................................... 44

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