内容发布更新时间 : 2024/5/12 9:14:59星期一 下面是文章的全部内容请认真阅读。
本科毕业设计论文
第I页共Ⅲ页
毕业设计说明书（论文）中文摘要
GSM模块，是一个类似于手机的通讯模块，集成了手机的若干功能于一块小电路板上，它可以发送短消息，通话等等，模块虽小，但它具备了很多手机的功能，拥有它等于就是拥有了手机的核心部分了，它在很多领域中都有着广泛的应用，GSM模块是通过AT指令控制的。本项目是关于GSM模块的远程温控的设计，其功能主要通过软件编程来实现。该系统主要由GSM模块TC35i、STC89C51单片机、DSl8B20温度传感器等构成。首先单片机要实现测温功能，通过单片机上的温度传感器采集到周围的温度。其次实现单片机与GSM模块的通信，手机发送短信给GSM模块的SIM卡，GSM模块接收信息后收集单片机上当时的温度，并把该温度发给手机。 关键词 GSM模块；STC89C51单片机；温度传感器DS18B20；手机 本科毕业设计论文
第II页共Ⅲ页
毕业设计说明书（论文）外文摘要
Abstract The GSM module, is one model the same as photo communication module, it certain functions on a small circuit wafer, it may transmit the short news, telephone conversation and so on, although the modules are small, but it has had many handset's functions, has it to be equal to that had handset's hard core, it has the widespread application in many place, the GSM module is controled by AT. This project is about long-distance controls warm about the GSM module, its function mainly realizes through the software programming. This system mainly by GSM module, the STC89C51 , the DSl8B20 temperature sensor and so on constitutes. First monolithic confidential realizes the temperature measurement function, gathers periphery through monolithic integrated circuit's on temperature sensor the temperature. Next realizes the monolithic integrated circuit and the GSM module correspondence, photo transmission note for SIM card, after the GSM module receive information, collected the temperature then transmission it to mobile. Keywords GSM module; 51 microcomputer; temperature sensor; Mobile 本科毕业设计论文
目 次
第III页共Ⅲ页
1 绪论 .................................................................... 1 2 系统总体结构与功能现象 .................................................. 2 2.1系统构成 ................................................................ 2 2.2功能及现象 .............................................................. 2 3 GSM模块介绍 ............................................................. 3 3.1 GSM介绍 ................................................................ 3 3.2 TC35i引脚介绍 .......................................................... 3 3.3 TC35i通信 .............................................................. 3 4 DS18B20温度传感器 ....................................................... 5 4.1 DS18B20介绍 ............................................................ 5 4.2 DS18B20引脚 ............................................................ 7 5 单片机介绍 .............................................................. 8 5.1 STC89C51RC单片机 ....................................................... 8 5.3 STC89C51RC芯片引脚介绍 ................................................. 9 6 软件介绍 ............................................................... 10 6.1项目介绍与AT指令 ...................................................... 10 6.2 TC35i模块测试软件 ..................................................... 11 6.3 STC芯片烧写软件 ....................................................... 13 结论 ...................................................................... 14 致谢 ...................................................................... 15 参考文献 .................................................................. 16 附录A（系统硬件原理模块图） ............................................... 17 附录B(软件程序设计) ....................................................... 18 附录C（电路实物图） ....................................................... 29