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IPC--版中文版
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IPC2223中文版
柔性电路板设计规范
目录
1 范围.................................................................................................................... 5
1.1目的 ................................................................................................... 5 1.2 产品分类 .......................................................................................... 5
1.2.1 电路板分类 ..................................................................... 5 1.2.2 安装用途 ......................................................................... 9 1.3 修订版本 ........................................................................... 10
2 适用文件.......................................................................................................... 10
2.1 IPC .................................................................................................. 10 2.2 联合行业标准 ................................................................................. 10
3 通用要求.......................................................................................................... 11
3.1 设计模型 ........................................................................................ 11 3.2 设计Layout ................................................................................... 12
3.2.1 机械设计效率（考虑最终排版） ................................ 12 3.2.2加工图建议事项 ............................................................. 12
3.3 结构原理 ........................................................................................ 13 3.4 有关测试要求的考虑事项 ............................................................ 13
3.4.1 环境要求 ........................................................................ 13 3.4.2 机械/挠曲要求............................................................... 13
4 材料.................................................................................................................. 13
4.1 选用材料 ........................................................................................ 13
4.1.1 材料的可选性 ................................................................ 15
4.2 介质材料（包括半固化片和接着剂） ........................................ 16
4.2.1粘结片预浸材料（半固化片） ..................................... 16 4.2.2 接着剂（液体） ............................................................ 16 4.2.3 挠性粘结膜（浇铸接着剂或粘结层） ........................ 16 4.2.4各向异性导电胶 ............................................................. 17
4.3 导电层（表面处理） .................................................................... 19
4.3.1 镀铜 ................................................................................. 19 4.3.1.1 挠性安装应用 ............................................................. 19 4.3.2 镀镍 ................................................................................ 21 4.3.3 镀锡铅 ............................................................................ 21
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4.3.4 焊锡涂敷 ........................................................................ 21 4.3.5 其它金属涂层 ................................................................ 21 4.3.6 电子元件材料（嵌入式电阻和电容） ........................ 22 4.3.7 屏蔽用导电涂层 ............................................................ 23
4.4 有机保护涂层 ................................................................................. 23
4.4.1 阻焊层 ............................................................................ 23 4.4.2 Conformal Coating ....................................................... 23
4.5标记和符号 ...................................................................................... 23
5 机械和物理性能 ............................................................................................. 23
5.1 加工要求 ......................................................................................... 23
5.1.1裸板加工 ......................................................................... 23 5.1.2 卷对卷加工（Roll to Roll） .......................................... 24
5.2 产品/板构型 .................................................................................. 24
5.2.1 电路外形 ........................................................................ 24 5.2.2 刚性区考虑事项 ............................................................ 27 5.2.3 挠性区 ............................................................................ 28 5.2.4 预成型弯曲 .................................................................... 36 5.2.5 差分长度 ......................................................................... 38 5.2.6屏蔽 ................................................................................. 43 5.2.7 接地/电源层................................................................... 44 5.2.8补强板和散热片 ............................................................. 44 5.2.9挠性印制电路板和软硬复合板的应变消除圆角指导方针 ....................................................................................................... 44 5.3 组装要求 ........................................................................................ 46
5.3.1 机械考虑事项 ................................................................ 46 5.3.2 托架式挠性和刚挠印制电路板 .................................... 46 5.3.3单面托架式电路板 .......................................................... 47 5.3.4非托架式挠性和刚挠印制板 .......................................... 47 5.3.5湿度 ................................................................................. 47 5.3.6 红外线预热和回流 ........................................................ 48 5.3.7 接着剂玻璃化温度（Tg） ............................................ 48
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